X-Ray BGA analysis

We understand that ensuring the highest quality of solder joints is critical for the reliability and performance of your electronic products. Our state-of-the-art X-ray BGA Soldering Quality Analysis services, based on the TR7600F3D SII 3D AXI machine, are designed to provide a comprehensive and non-destructive inspection of Ball Grid Array (BGA) solder joints, enabling us to detect any defects that might affect your assembly’s functionality.

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Why X-RAY BGA Inspection is Essential
 

BGA packages, due to their design, have solder balls hidden beneath the component, making traditional inspection methods, like optical inspection, ineffective. X-ray technology allows us to penetrate through the component and examine the solder joints for hidden defects such as:

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• Cold Solder Joints

• Bridging

• Open Circuits

• Solder Voids 

• Solder Ball Misalignment

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Detecting these issues early ensures that you can avoid costly rework, improve the reliability of your final products, and maintain compliance with industry standards.

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Our X-RAY Inspection Process

 

1. Non-Destructive Testing:  Our X-ray inspection system offers a 100% non-destructive analysis, allowing us to detect issues without damaging your PCB.

2. High-Resolution Imaging: We utilize high-resolution X-ray imaging to capture detailed views of the BGA solder joints, ensuring a clear and precise evaluation.

3. Advanced Software Analysis: Our cutting-edge software tools process the X-ray images to automatically identify potential defects, flagging areas that may require further attention or rework.

4. Comprehensive Reporting: You will receive a detailed report outlining the findings from the inspection, including visual evidence and clear recommendations for corrective action if needed.

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Benefits of Our X-RAY BGA Soldering Quality Analysis

 

• Enhanced Product Reliability: Prevents hidden defects from compromising the performance of your electronics.

• Increased Manufacturing Efficiency: Reduces the risk of post-production failures, which can lead to expensive recalls or repairs.

• Fast Turnaround: Our advanced X-ray technology provides quick and accurate results, ensuring timely feedback and enabling rapid decision-making.

• Compliance with Industry Standards: Our processes are aligned with the highest industry standards and best practices, ensuring your products meet global quality certifications.

 

The TR7600F3D SII is the next-generation high-speed in-line automated X-Ray inspection solution, soaring speeds as to twice to three times as fast as the previous models. The AXI solution can inspect large boards, up to 900 mm x 460 mm. The TR7600F3D SII lowers the escapes and false calls without compromising the
production line’s cycle time.

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The TR7600F3D SII enhanced 3D inspection with planar CT imaging can recreate a complete 3D model of each solder joint, enabling clear analysis of shape irregularities, head-in pillow and voiding problems. Vertical cross-section CT images help with reliable visual review of borderline and buried solder joints.

Why Choose Us?

Experienced Team: Our technicians have years of experience in PCB assembly and X-ray inspection, delivering accurate and reliable results.
State-of-the-Art Equipment: We invest in the latest X-ray inspection technology to guarantee the best results.
Quality Assurance: We are committed to delivering the highest quality standards to our clients, ensuring your products are built to last.

Get in Touch
 

If you're looking to ensure the quality and reliability of your BGA or QFN soldering, contact us today to learn more about our X-ray Soldering Quality Analysis Services. Let us help you keep your products defect-free and your production process running smoothly.